PARAMETER | U.M. | Minimum | Maximum | |
Assay (NH3) | % | 28.0 | 30.0 | |
Color | APHA | 5 | ||
Chloride (Cl) | ppm | 0.01 | ||
Carbonate (as CO3) | ppm | 1 | ||
Sulfate (SO4) | ppm | 0.01 | ||
Phosphate (PO4) | ppm | 0.01 | ||
Reducing Substance, Permanganate (as KMnO4) | ppm | 0.5 | ||
MAXIMUM OF IMPURITIES | U.M. | Minimum | Maximum | |
Aluminum (Al) | ppb | 0.05 | ||
Antimony (Sb) | ppb | 0.05 | ||
Arsenic (As) | ppb | 0.05 | ||
Barium (Ba) | ppb | 0.05 | ||
Beryllium (Be) | ppb | 0.05 | ||
Bismuth (Bi) | ppb | 0.05 | ||
Boron (B) | ppb | 0.05 | ||
Cadmium (Cd) | ppb | 0.05 | ||
Calcium (Ca) | ppb | 0.05 | ||
Chromium (Cr) | ppb | 0.05 | ||
Cobalt (Co) | ppb | 0.05 | ||
Copper (Cu) | ppb | 0.05 | ||
Gallium (Ga) | ppb | 0.05 | ||
Germanium (Ge) | ppb | 0.05 | ||
Gold (Au) | ppb | 0.05 | ||
Iron (Fe) | ppb | 0.05 | ||
Lead (Pb) | ppb | 0.05 | ||
Lithium (Li) | ppb | 0.05 | ||
Magnesium (Mg) | ppb | 0.05 | ||
Manganese (Mn) | ppb | 0.05 | ||
Molybdenum (Mo) | ppb | 0.05 | ||
Nickel (Ni) | ppb | 0.05 | ||
Niobium (Nb) | ppb | 0.05 | ||
Potassium (K) | ppb | 0.05 | ||
Silver (Ag) | ppb | 0.05 | ||
Sodium (Na) | ppb | 0.05 | ||
Strontium (Sr) | ppb | 0.05 | ||
Tantalum (Ta) | ppb | 0.05 | ||
Thallium (Tl) | ppb | 0.05 | ||
Tin (Sn) | ppb | 0.05 | ||
Titanium (Ti) | ppb | 0.05 | ||
Vanadium (V) | ppb | 0.05 | ||
Zinc (Zn) | ppb | 0.05 | ||
Zirconium (Zr) | ppb | 0.05 | ||
PARTICULATE COUNT | U.M. | Minimum | Maximum | |
≧0.1 micron | pcs/ml | 200 | ||
≧0.2 micron | pcs/ml | 50 | ||
≧0.5 micron | pcs/ml | 30 | ||
≧1.0 micron | pcs/ml | 10 |
Physical and Chemical Properties
- Density: ~0.88 g/cm³ (at 20°C)
- Boiling Point: ~36°C (varies with concentration)
- Melting Point: ~-77°C
- pH: Strongly alkaline (pH >11)
- Solubility: Completely miscible with water, reacts with acids
- Decomposition: Releases ammonia gas (NH₃) over time, especially when heated
Key Applications
- Semiconductor Industry:
- Used in RCA cleaning (SC-1) for removing organic and particle contamination from wafers
- Essential in etching and chemical mechanical planarization (CMP) processes
- Electronics Manufacturing:
- High-purity alkaline etchant for microelectronics and display panels
- Key reagent in photoresist stripping
- Chemical & Pharmaceutical Synthesis:
- Used in high-purity chemical formulations
- Precursor for ammonium-based compounds in research and industry
- Environmental & Analytical Applications:
- Employed in ultra-pure water production and wastewater treatment
- Reagent in ICP-MS and other trace analysis techniques
Safety and Handling
- Hazards: Corrosive, causes severe irritation to skin, eyes, and respiratory tract. Can release hazardous ammonia fumes.
- Storage:
- Store in tightly sealed, compatible containers (e.g., PTFE, PFA, or high-purity HDPE)
- Keep in a cool, well-ventilated area away from acids and oxidizers
- Protective Equipment: Use chemical-resistant gloves, safety goggles, and work under fume hoods. Ensure proper ventilation when handling.
Market and Supply
- Major Producers: BASF, Merck, Kanto Chemical, Mitsubishi Chemical, etc.
- Packaging: Typically supplied in high-purity containers (2.5L, 25L, or bulk formats) for industrial applications
- Regulations: Complies with SEMI C9 and other industry standards for ultra-high purity aqueous ammonia