Ultra pure nitric acid
Chemical Name: Ultra Pure Nitric Acid
Molecular Formula: HNO₃
Molecular Weight: 63.01 g/mol
CAS Number: 7697-37-2
EC Number: 231-714-2
| PARAMETER | U.M. | Minimum | Maximum | |
| Assay (HNO3) | % | 69.0 | 70.0 | |
| Color | APHA | 5 | ||
| Chloride (Cl) | ppb | 80 | ||
| Phosphate (PO4) | ppb | 50 | ||
| Sulfate (SO4) | ppb | 100 | ||
| MAXIMUM OF IMPURITIES | U.M. | Minimum | Maximum | |
| Aluminum (Al) | ppb | 0.05 | ||
| Antimony (Sb) | ppb | 0.05 | ||
| Arsenic (As) | ppb | 0.05 | ||
| Barium (Ba) | ppb | 0.05 | ||
| Beryllium (Be) | ppb | 0.05 | ||
| Bismuth (Bi) | ppb | 0.05 | ||
| Boron (B) | ppb | 0.05 | ||
| Cadmium (Cd) | ppb | 0.05 | ||
| Calcium (Ca) | ppb | 0.05 | ||
| Chromium (Cr) | ppb | 0.05 | ||
| Cobalt (Co) | ppb | 0.05 | ||
| Copper (Cu) | ppb | 0.05 | ||
| Gallium (Ga) | ppb | 0.05 | ||
| Germanium (Ge) | ppb | 0.05 | ||
| Gold (Au) | ppb | 0.05 | ||
| Iron (Fe) | ppb | 0.05 | ||
| Lead (Pb) | ppb | 0.05 | ||
| Lithium (Li) | ppb | 0.05 | ||
| Magnesium (Mg) | ppb | 0.05 | ||
| Manganese (Mn) | ppb | 0.05 | ||
| Molybdenum (Mo) | ppb | 0.05 | ||
| Nickel (Ni) | ppb | 0.05 | ||
| Niobium (Nb) | ppb | 0.05 | ||
| Potassium (K) | ppb | 0.05 | ||
| Selenium (Se) | ppb | 0.05 | ||
| Silver (Ag) | ppb | 0.05 | ||
| Sodium (Na) | ppb | 0.05 | ||
| Strontium (Sr) | ppb | 0.05 | ||
| Tantalum (Ta) | ppb | 0.05 | ||
| Thallium (Tl) | ppb | 0.05 | ||
| Tin (Sn) | ppb | 0.05 | ||
| Titanium (Ti) | ppb | 0.05 | ||
| Tungsten (W) | ppb | 0.05 | ||
| Vanadium (V) | ppb | 0.05 | ||
| Zinc (Zn) | ppb | 0.05 | ||
| Zirconium (Zr) | ppb | 0.05 | ||
| PARTICULATE COUNT | U.M. | Minimum | Maximum | |
| ≧0.1 micron | pcs/ml | 300 | ||
| ≧0.5 micron | pcs/ml | 50 | ||
| ≧1.0 micron | pcs/ml | 10 | ||
Physical and Chemical Properties
- Density: ~1.41 g/cm³ (at 20°C)
- Boiling Point: ~83°C
- Melting Point: -42°C
- pH: Strongly acidic
- Solubility: Completely miscible with water, reacts violently with organic solvents
- Decomposition: Releases NO₂ gas upon heating or exposure to light
Key Applications
- Semiconductor Industry:
- Essential for wafer cleaning and etching processes
- Used in RCA cleaning (SC-2) to remove metal contaminants
- Electronics Manufacturing:
- High-purity oxidizer in circuit board and component production
- Etchant in microfabrication and photolithography
- Chemical Synthesis & Research:
- Reagent in high-purity chemical and pharmaceutical synthesis
- Precursor for nitration reactions
- Metallurgy & Surface Treatment:
- Used in passivation of stainless steel
- High-purity nitric acid for metal etching and refining
- Environmental & Analytical Applications:
- Used in ICP-MS and other trace analysis techniques
- Employed in ultrapure water production
Safety and Handling
- Hazards: Strong acid and oxidizer, highly corrosive to metals and skin, releases toxic NOx fumes upon decomposition.
- Storage:
- Keep in acid-resistant, tightly sealed containers (e.g., PTFE, PFA, or glass)
- Store in a cool, dark, well-ventilated area away from organic materials
- Protective Equipment: Use chemical-resistant gloves, safety goggles, and acid-proof clothing. Ensure proper ventilation when handling.
Market and Supply
- Major Producers: BASF, Merck, Mitsubishi Chemical, Kanto Chemical, etc.
- Packaging: Supplied in HDPE or fluoropolymer containers, commonly in 2.5L, 25L, or bulk packaging for industrial use
- Regulations: Complies with SEMI C7 standards for semiconductor applications and other high-purity industry requirements
