7664-93-9
Chemical Name: Ultra Pure Sulfuric Acid
Molecular Formula: H₂SO₄
Molecular Weight: 98.08 g/mol
CAS Number: 7664-93-9
| PARAMETER | U.M. | Minimum | Maximum | |
| Assay (H2SO4) | % | 96.0 | 97.0 | |
| Color | APHA | 5 | ||
| Chloride (Cl) | ppb | 50 | ||
| Nitrate (NO3) | ppm | 0.1 | ||
| Phosphate (PO4) | ppm | 0.1 | ||
| NH4 | ppm | 1 | ||
| Residue After Igination (RAI) | ppm | 1 | ||
| Reducing Substance, Permanganate (as KMnO4) | ppm | 1 | ||
| MAXIMUM OF IMPURITIES | U.M. | Minimum | Maximum | |
| Aluminum (Al) | ppb | 0.05 | ||
| Antimony (Sb) | ppb | 0.05 | ||
| Arsenic (As) | ppb | 0.05 | ||
| Barium (Ba) | ppb | 0.05 | ||
| Beryllium (Be) | ppb | 0.05 | ||
| Bismuth (Bi) | ppb | 0.05 | ||
| Boron (B) | ppb | 0.05 | ||
| Cadmium (Cd) | ppb | 0.05 | ||
| Calcium (Ca) | ppb | 0.05 | ||
| Chromium (Cr) | ppb | 0.05 | ||
| Cobalt (Co) | ppb | 0.05 | ||
| Copper (Cu) | ppb | 0.05 | ||
| Gallium (Ga) | ppb | 0.05 | ||
| Germanium (Ge) | ppb | 0.05 | ||
| Gold (Au) | ppb | 0.05 | ||
| Indium (In) | ppb | 0.05 | ||
| Iron (Fe) | ppb | 0.05 | ||
| Lead (Pb) | ppb | 0.05 | ||
| Lithium (Li) | ppb | 0.05 | ||
| Magnesium (Mg) | ppb | 0.05 | ||
| Manganese (Mn) | ppb | 0.05 | ||
| Molybdenum (Mo) | ppb | 0.05 | ||
| Mercury (Hg) | ppb | 0.05 | ||
| Nickel (Ni) | ppb | 0.05 | ||
| Niobium (Nb) | ppb | 0.05 | ||
| Potassium (K) | ppb | 0.05 | ||
| Selenium (Se) | ppb | 0.05 | ||
| Silicon (Si) | ppb | 0.5 | ||
| Silver (Ag) | ppb | 0.05 | ||
| Sodium (Na) | ppb | 0.05 | ||
| Strontium (Sr) | ppb | 0.05 | ||
| Tantalum (Ta) | ppb | 0.05 | ||
| Thallium (Tl) | ppb | 0.05 | ||
| Tin (Sn) | ppb | 0.05 | ||
| Titanium (Ti) | ppb | 0.05 | ||
| Vanadium (V) | ppb | 0.05 | ||
| Zinc (Zn) | ppb | 0.05 | ||
| Zirconium (Zr) | ppb | 0.05 | ||
| PARTICULATE COUNT | U.M. | Minimum | Maximum | |
Physical and Chemical Properties
- Density: ~1.84 g/cm³ (at 20°C)
- Boiling Point: ~290°C (decomposes before boiling)
- Melting Point: ~10°C
- pH: Strongly acidic (pH <1)
- Solubility: Completely miscible with water (exothermic reaction)
- Decomposition: Produces SO₃, SO₂, and H₂O at high temperatures
Key Applications
- Semiconductor Industry:
- Critical for wafer cleaning and etching (SC-1 and SC-2 RCA cleaning)
- Removes organic contaminants and metallic residues from microchips
- Electronics Manufacturing:
- Used in high-purity etching solutions for PCBs and microfabrication
- Key component in chemical mechanical planarization (CMP) processes
- Pharmaceutical & Chemical Synthesis:
- High-purity reagent for precision chemical reactions
- Catalyst in high-purity sulfuric acid-mediated synthesis
- Battery & Energy Storage:
- Essential in lithium-ion and lead-acid battery production
- Environmental & Analytical Applications:
- Employed in ICP-MS and trace metal analysis
- Key reagent in ultra-pure water production
Safety and Handling
- Hazards: Strong acid, highly corrosive, causes severe burns, reacts violently with water and organic materials.
- Storage:
- Use acid-resistant containers (PTFE, PFA, or specialized HDPE)
- Store in a cool, dry, well-ventilated area away from heat sources
- Protective Equipment: Use chemical-resistant gloves, face shields, acid-proof clothing, and work under fume hoods.
Market and Supply
- Major Producers: BASF, Merck, Kanto Chemical, Mitsubishi Chemical, etc.
- Packaging: Supplied in fluoropolymer-lined drums or high-purity containers, available in 2.5L, 25L, or bulk formats
- Regulations: Complies with SEMI C9 standards for semiconductor-grade sulfuric acid
